Overbanding

Jointline’s airfield Overbanding capabilities offer a comprehensive solution to surface protection, utilising HAPAS approved materials to ensure the highest standards of quality and safety. Overbanding is a critical process in maintaining the integrity of surfaces, whether it’s a result of spontaneous wear and tear that requires immediate repair or the need to seal the joint between old and new surfaces.

The process of Overbanding is vital in preventing damage and surface fretting caused by the penetration of water, dirt, or spillage. By effectively sealing the joint and overlapping the two sides of the join up to 200mm, Overbanding ensures that no foreign material can enter the crack and further degrade the surface. This is achieved through two primary methods:

Hot Applied Bituminous Material: This method is used to seal and overband the crack, providing a robust and durable solution.

Cold Applied Resins: An alternative method that may be chosen based on the project characteristics, the type of materials on either side of the crack, and the specific use of the surface, such as a runway or an airport fuelling area.

Jointline’s commitment to health and safety is paramount, and both overbanding methods are HAPAS approved, ensuring compliance with stringent regulations. The high skid resistance values of the materials used in the Overbanding process are essential to conform to requirements, particularly in wet conditions, thereby preventing aircraft and service vehicles from slipping or skidding on the overbanded area.

Jointline’s airfield Overbanding capabilities provide a tailored, efficient, and safety-conscious approach to surface protection. By employing HAPAS approved materials and methods, Jointline ensures the longevity and integrity of surfaces, safeguarding them against potential damage and degradation. Whether it’s a spontaneous repair or a planned joint sealing, Jointline’s expertise in Overbanding guarantees a solution that meets the technical and safety needs of any project and airfield.